Process of surface treatment, surface treating device, surface treated plate, and electro-optic device, and electronic equipment

ABSTRACT

A process of providing a hydrophobic property to the surface of a plate, and a process of providing a hydrophilic property to the surface by irradiating energy light (radiation) on the surface of the plate, which is provided with the hydrophobic property are provided. Variations in the accumulated illumination intensity of radiation on the surface of the plate are controlled to 20% or less.

RELATED APPLICATIONS

[0001] This application claims priority to Japanese Patent ApplicationNo. 2003-085538 filed Mar. 26, 2003 and 2004-035082 filed Feb. 12, 2004which are hereby expressly incorporated by reference herein in theirentireties.

BACKGROUND

[0002] 1. Technical Field

[0003] The present invention relates to a process of surface treatment,a surface treating device, a surface treated plate, an electro-opticdevice, and electronic equipment.

[0004] 2. Background Art

[0005] Wiring used for electronic circuits or integrated circuits ismanufactured, for example, by a photolithography method. In thephotolithography method, the wiring is formed by applying photosensitivematerial called resist on a plate, on which a conductive film is appliedin advance, developing by irradiating a circuit pattern, and etching theconductive film according to a resist pattern. The lithography methodrequires large scale equipment and complex processes such as a vacuumdevice, and the material usage efficiency is only several percent.Therefore, most of the material has to be put on the shelf, and hence itrequires high manufacturing costs.

[0006] Alternatively, there is proposed a wiring pattern forming processusing a process of discharging liquid drops, which is a so-called inkjetmethod, in which liquid material is discharged in the form of liquiddrops from a liquid drop discharging head (For example, see U.S. Pat.No. 5,132,248). In this method, ink for a wiring pattern, which isfunctional liquid containing conductive fine particles such as metalparticles disposed therein is applied directly to the plate as apattern, which is converted into a conductive film pattern bysubsequently performing heat treatment or laser irradiation. This methodhas advantages such that photolithography is no longer necessary, andhence the process is significantly simplified, and at the same time, theamount of material to be used may be reduced.

[0007] In order to perform conductive film wiring by the inkjet methodadequately, a process of selectively discharging liquid material by theinkjet method onto a liquid preferring (hydrophilic) portion of a plate,on which a pattern of a liquid rejecting portion (hydrophobic) and theliquid preferring portion is formed in advance, is proposed. In thiscase, since liquid containing the conductive fine particles dispersedtherein tends to be trapped on the liquid preferring portion, formationof wiring with positional accuracy is achieved without forming a bank.

[0008] In this case, as a process of providing the hydrophobic property,a process of forming a liquid rejecting unimolecular film such as aself-organized film formed of an organic molecule on the surface of theplate, and a process of forming a fluorinated polymerized film on thesurface of the plate, such as a plasma processing generatingfluorocarbon contained compound as a reactive gas are known.

[0009] On the other hand, as a process of providing the hydrophilicproperty, a process of disrupting the liquid rejecting film once formedby irradiating ultraviolet light after liquid rejecting finishing isknown.

[0010] However, there are problems as shown below.

[0011] In the case where a film pattern is formed using a plate on whichthe hydrophilic property or the hydrophobic property is provided, it isnecessary to control the contact angle between the liquid member and theplate to be substantially uniform. This is because variations inhydrophilic property on the plate affect uniformity of dot diameter,that is, the line width or the film thickness.

[0012] However, in recent years, as the plate is upsized (enlarged),variations in hydrophilic property on the surface of the plate increasecorrespondingly. Therefore, there is fear that the contact angle betweenliquid and the plate cannot be controlled to be uniform.

[0013] In view of such points described above, it is an object of thepresent invention to provide a process of surface treatment in which thecontact angle between the liquid member and the plate can be uniformlycontrolled even with the large size plate, a surface treating device, asurface treated plate, and an electro-optic device and electronicequipment having the surface treated plate.

SUMMARY

[0014] In order to achieve the above-described object, the presentinvention employs the following configuration.

[0015] A process of surface treatment of the present invention includes:a step of providing a hydrophobic property to the surface of a plate anda step of providing a hydrophilic property to the surface of the plateprovided with the hydrophobic property by irradiating radiation (e.g.,energy light) such as ultraviolet light, and is characterized in thatvariations in accumulated illumination intensity of the radiation on thesurface of the plate are controlled to 20% or less. More preferably,variations in accumulated illumination intensity of the radiation on thesurface of the plate are controlled to 15% or less.

[0016] Therefore, according to the present invention, variations inhydrophilic property provided on the plate can be control within apredetermined range, and variations in contact angle between the plateand liquid member can also be controlled. Consequently, the dot diameterof the liquid member applied on the plate, that is, uniformity of theline width or the film thickness formed of the liquid member isachieved.

[0017] As a process of controlling variations in accumulatedillumination intensity of the radiation on the surface of the plate, aprocess of irradiating the radiation while relatively moving the platewith respect to a source of the radiation can be employed.

[0018] Accordingly, unevenness of distribution of energy to beirradiated on the plate can be alleviated and hence variations inaccumulated illumination intensity can be controlled.

[0019] In the case where a plurality of rows of sources of the radiationare arranged in association with upsizing of the plate, it is preferredto move the plate in the direction of the arrangement of the pluralityof radiation sources with respect thereto.

[0020] Consequently, according to the present invention, even whenvariations in irradiating energy exist among the plurality of sources,unevenness of distribution of the energy to be irradiated on the platecan be alleviated to obtain uniform accumulated illumination intensity.

[0021] Preferably, the present invention includes a step of measuringillumination intensity of the radiation at a plurality of points on thesurface of the plate and in the vicinity of the plate respectivelybefore providing the hydrophilic property, and a step of controllingirradiation of the radiation based on the accumulated illuminationintensity of the radiation in the vicinity of the plate measured duringthe process of providing the hydrophilic property.

[0022] Consequently, according to the present invention, by obtainingthe relative relation between the illumination intensity of theradiation on the surface of the plate and the illumination intensity ofthe radiation in the vicinity of the plate in advance, and thenmeasuring and monitoring the illumination intensity of the radiation inthe vicinity of the plate during the step of providing the hydrophilicproperty, the point at which accumulated illumination intensity of theradiation on the surface of the plate reaches a predetermined value canbe detected without measuring the illumination intensity on the surfaceof the plate so that irradiation of the radiation can be stopped.

[0023] A surface treated plate according to the present invention ischaracterized in that the surface treatment is applied according to theabove-described process of surface treatment.

[0024] Consequently, according to the present invention, since thedesired hydrophilic property is provided uniformly, uniformity of theline width or the film thickness formed of the liquid member is achievedwhen the liquid member is discharged on the plate in the form of liquiddrops.

[0025] An electro-optic device according to the present invention ischaracterized in that a conductive film wiring formed on the surfacetreated plate according to the present invention is provided. Electronicequipment of the present invention is characterized in that theelectro-optic device according to the present invention is provided.

[0026] Consequently, according to the present invention, a high qualityelectro-optic device and electronic equipment which are advantageous forconduction of electricity and hardly suffers from defects such asdisconnection or short circuit by virtue of the conductive film having apredetermined line width or film thickness.

[0027] On the other hand, a surface treating device of the presentinvention is a plate treating device for providing the surface with ahydrophilic property by irradiating the radiation on the surface of theplate, and is characterized in that a reciprocating device forrelatively moving the source of the radiation and the plate.

[0028] Consequently, according to the present invention, unevenness ofdistribution of energy to be irradiated on the plate can be alleviatedand hence variations in accumulated illumination intensity may becontrolled.

[0029] Preferably, the plate is relatively moved along the direction ofthe arrangement of the plurality of rows of radiation sources.

[0030] Accordingly, in the case where a plurality of rows of sources forthe radiation are arranged in association with upsizing of the plate,even when variations in irradiating energy exist among the plurality ofradiation sources, unevenness of distribution of energy to be irradiatedon the plate can be alleviated to obtain uniform accumulatedillumination intensity.

BRIEF DESCRIPTION OF THE DRAWINGS

[0031]FIG. 1 is a general plan view showing a state in which a plate isplaced on a surface treating device.

[0032]FIG. 2 is a front view of FIG. 1.

[0033]FIG. 3 is an explanatory drawing showing the principle ofdischarge of liquid member by a piezoelectric system.

[0034]FIG. 4 is a general perspective view of a wiring forming device.

[0035]FIG. 5 is a plan view of the plate of a liquid crystal displaydevice according to a third embodiment.

[0036]FIG. 6 is a drawing of another embodiment of the liquid crystaldisplay device.

[0037]FIG. 7 is an exploded perspective view of a plasma-type displaydevice according to a fourth embodiment.

[0038]FIG. 8 is an exploded perspective view of a non-contact cardmedium according to a fifth embodiment.

[0039] FIGS. 9A-C are explanatory drawings showing a field emissiondisplay (FED).

[0040] FIGS. 10A-C are drawings showing a detailed example of electronicequipment according to the present invention.

DETAILED DESCRIPTION

[0041] Referring to FIG. 1 to FIG. 10, embodiments of a process ofsurface treatment, a surface treating device, a surface treated plate,and an electro-optic device, and electronic equipment according to thepresent invention will be described.

[0042] First Embodiment

[0043] As a first embodiment, a process of surface treatment accordingto the present invention will be described.

[0044] The surface treatment according to the present embodiment iscomposed of a process of providing a hydrophobic property and a processof providing a hydrophilic property. Each of these processes will bedescribed below.

[0045] Process of Providing Hydrophobic Property

[0046] As one of the processes of providing the hydrophobic property,there is a process of forming a self-organized film formed for exampleof an organic molecular film on the surface of a plate.

[0047] The organic molecular film for treating the surface of the plateincludes a functional group which can be bonded to the plate at one end,a functional group for converting the property of the surface of theplate to a hydrophobic property or the like (controlling surface energy)at the other end, and a carbon straight chain or a partly branchedcarbon chain for connecting these functional groups, and is bonded tothe plate and self-organized to form a molecular film, such as aunimolecular film.

[0048] The self-organized film includes a bonding function group capableof reacting to a foundation layer constituting an atom such as the plateand other straight molecules and is formed by orienting a chemicalcompound having an extremely high orientation by virtue of mutual actionof the straight molecules. Since the self-organized film is formed byorienting a monomolecule, the film thickness can be reduced extremely.In addition, a uniform film in a molecular level is obtained. That is,since the same molecule is placed on the surface of the film, a uniformand superior hydrophobic property may be provided to the surface of thefilm.

[0049] For example, when fluoroalkylsilane is employed as the chemicalcompound having a high orientation, each compound is oriented so thatthe fluoroalkyl group is positioned on the surface of the film, and theself-organized film is formed. Therefore, a uniform hydrophobic propertyis provided on the surface of the film.

[0050] The compound which form such a self-organized film may befluoroalkylsilane(hereinafter referred to as “FAS”) such asHeptadecafluoro-1,1,2,2-tetrahydrodecyltriethoxysilane,Heptadecafluoro-1,1,2,2-tetrahydrodecyltrimethoxysilane,Heptadecafluoro-1,1,2,2-tetrahydrodecyltrichlorosilane,Tridecafluoro-1,1,2,2-tetrahydrooctyltriethoxysilane,Tridecafluoro-1,1,2,2-tetrahydrooctyltrimethoxysilane,Tridecafluoro-1,1,2,2-tetrahydrooctyltrichlorosilane, andTrifluoropropyltrimethoxysilane. As regards usage, though it is alsopreferable to use a single chemical compound independently, two or morechemical compounds may be combined for use as long as a desired objectis not hindered. In the present invention, it is preferable to use theFAS as the chemical compound forming the self-organized film whenconsidering the provision of adhesiveness with respect to the plate anda desirable hydrophobic property.

[0051] The FAS is generally represented by a constitutional formulaRnSiX_((4-n)). Here, the sign n represents an integer between 1 and 3inclusive, and X represents hydrolysable group such as methoxy group,ethoxy group, and halogen atom. The sign R represents fluoroalkyl group,having a constitution of (CF₃) (CF₂) x (CH₂)y (where the sign xrepresents an integer between 0 and 10 inclusive, and the sign yrepresents an integer between 0 and 4 inclusive), and when a pluralityof Rs or Xs are bonded to Si, all the Rs or Xs may be the same, or maybe different. The hydrolysable group represented by X forms silanol byhydrolysis, responds to hydroxyl group of the backing such as plate(glass, silicon) and bonded to the plate by siloxane bond. On the otherhand, since R has a fluoro group such as (CF₃) on the surface, itmodifies the base surface such as the plate into a surface that does notget wet (low in surface energy).

[0052] The self-organized film formed of organic molecular film or thelike is formed on the plate by placing the above-described materialchemical and the plate in the same sealed container, and, in case ofroom temperature, leaving it to stand for about two or three days.Alternatively, by keeping the sealed container at a temperature of 100°C., it is formed in about three hours on the plate. While the processdescribed above is a process for forming the self-organized film fromthe gas phase, it can also be formed from a liquid phase as well.

[0053] For example, the self-organized film can be formed on the plateby immersing the plate in a solution containing the material chemicalcompound and then cleaning and drying the same.

[0054] It is preferable to perform surface preparation by irradiatingultraviolet light onto the surface of the plate or by cleaning bysolvent before forming the self-organized film.

[0055] As another process of providing the hydrophobic property, thereis a process of irradiating plasma at a normal pressure or in vacuum.

[0056] The type of gas used for plasma treatment can be variouslyselected considering the quality of surface material of the plate. Forexample, fluorocarbon gas such as tetrafluromethane, perfluorohexane, orperfluorodecane can be used as a treatment gas. In this case, a film ofpolymer fluoride having a hydrophobic property can be formed on thesurface of the plate.

[0057] The process of providing a hydrophobic property may also beperformed by adhering a film having a desired hydrophobic property, suchas a polyimide film applied with tetrafluromethane, on the surface ofthe plate. The polyimide film may be used as the plate as it is.

[0058] Process of providing a hydrophilic property

[0059] Since the surface of the plate in the stage in which the processof providing a hydrophobic property has finished usually has ahydrophobic property higher than the desired hydrophobic property, thehydrophobic property is alleviated by the process of providing ahydrophilic property.

[0060] As the process of providing a hydrophilic property, there is aprocess of irradiating ultraviolet light of 170-400 nm as radiation.With this process, the film having the hydrophobic property once formedcan be partly destructed, but uniformly as a whole to alleviate thehydrophobic property.

[0061] In this case, the extent of alleviation of the hydrophobicproperty can be adjusted by the irradiation time of ultraviolet light,intensity, wavelength of the ultraviolet light, or the combinationthereof. However, in the present embodiment, it is controlled by theaccumulated illumination intensity of ultraviolet light on the surfaceof the plate, and variation of the accumulated illumination intensity iscontrolled to 20% or less.

[0062] Referring now to FIG. 1 and FIG. 2, the surface treating devicefor providing the hydrophilic property to the surface of the plate willbe described. FIG. 1 is a general plan view showing a state in which aplate 11 is placed on a surface treating device 31, and FIG. 2 is afront view.

[0063] The surface treating device 31 mainly includes a stage 33 capableof retaining the plate 11 and freely moving in the lateral direction inthe drawing while retaining the plate, a driving unit 34 for driving thestage 33, a plurality of (four in this embodiment) mercury lamps(radiation source) 35 arranged above the stage 33 at regular intervalsalong the direction of movement of the stage 33, a switching unit 36 forswitching on/off the irradiation of the mercury lamps 35, and a controlunit 37 for controlling the driving unit 34 and the switching unit 36.The stage 33 is provided with an illumination intensity sensor 38 in thevicinity of the plate 11. The stage 33, the driving unit 34, and thecontrol unit 37 constitute a moving device of the present invention.

[0064] Since irradiation energy of ultraviolet light at the end of themercury lamp 35 is not stable (low) in comparison with the centralportion thereof, the length thereof is determined so that the plate 11is positioned in the area where stable irradiation energy can beobtained.

[0065] When performing the process of providing the hydrophilic propertyto the plate 11, the stage 33 which is retaining the plate 11 isreciprocated (swung, relatively moved) in the direction indicated by anarrow in FIG. 2 with respect to the mercury lamp 35 in a state in whichthe mercury lamp 35 is turned on under control of the control unit 37.The surface of the plate 11 obtains the hydrophilic property when thehydrophobic property is alleviated by ultraviolet light, for example, of254 nm wavelength irradiated by the mercury lamp 35. In this case, whena plurality of mercury lamps 35 are used, slight variations inirradiation energy normally exist among the mercury lamps. However,since the plate 11 is moved via the stage 33, uneven distribution ofenergy irradiated to the plate can be alleviated.

[0066] On the other hand, before the process of providing thehydrophilic property, the relative relation among measurements isobtained by measuring the illumination intensity at a plurality ofpoints (at least, the ends and the central point are included) on thesurface of the plate by the illumination intensity sensor 38 on the testplate or the like in advance. Therefore, during the process of providingthe hydrophilic property, the accumulated illumination intensity ismonitored based on the illumination intensity measured by theillumination sensor 38, and the accumulated illumination intensity onthe surface of the plate from the above-described relative relation andthe result of monitoring is obtained. When the accumulated illuminationintensity on the surface of the plate reaches the predetermined value,the control unit 37 stops irradiation of ultraviolet light via theswitching unit 36. In this procedure, radiation can be irradiated to thesurface of the plate at the predetermined accumulated illuminationintensity without measuring the illumination intensity on the surface ofthe plate.

EXAMPLES

[0067] The result of measurement of accumulated illumination intensityon the surface of the plate, the dot diameter of liquid drops, and thecontact angle during treatment of providing the hydrophilic propertywill be shown in Table 1. The result of measurement is obtained fromliquid drops of silver(Ag)-independent dispersion liquid on the glassplate by irradiating ultraviolet light of 254 nm wavelength(illumination meter: Al ultraviolet light illumination meter UVPF-A1PD254), and a target dot diameter is about 60 μm. TABLE 1 Dot diameter(diameter Contact angle Accumulated of (Ag-independent illumination(mj/cm²) liquid drop) dispersion liquid) 1300 54 μm   34° 1400 60 μm31.6° 1620 60 μm   30° 1800 61 μm 29.4° 1950 65 μm   26°

[0068] As shown in the result of the measurements, for example, when theaccumulated illumination intensity 1620 mj/cm² is selected as a standardvalue, variations in dot diameter can be controlled to an extent inwhich no problems occurs in terms of the line width and the filmthickness by irradiating ultraviolet light at the accumulatedillumination intensity of 1300 mj/cm² (deviation from the standardvalue; about 20%) and at the accumulated illumination intensity of 1950mj/cm² (deviation from the standard value; about 20%). Furthermore, thedot diameter, that is, the contact angle can be maintained substantiallyconstant by irradiating ultraviolet light at the accumulatedillumination intensity of 1400 mj/cm² (deviation from the standardvalue; about 14%) and at the accumulated illumination intensity of 1800mj/cm² (deviation from the standard value; about 11%).

[0069] In this manner, according to the present embodiment, since thetreatment of providing the hydrophilic property is performed based onvariations in accumulated illumination intensity of ultraviolet light onthe surface of the plate, further reliable control of the dot diameterand the contact angle on the plate surface is ensured. In addition,according to the present embodiment, variations in dot diameter andcontact angle can be controlled by controlling variations in accumulatedillumination intensity to 20% or less. In particular, by controllingvariations in accumulated illumination intensity to 15% or less, the dotdiameter, that is, the contact angle can be maintained constant, andhence uniformity of the line width of the film thickness formed by theliquid member is achieved.

[0070] Furthermore, in the present embodiment, even when irradiationenergy varies among the plurality of mercury lamps, the effect of thevariation can be alleviated and hence ultraviolet light can beirradiated onto the entire surface of the plate at a substantiallyuniform accumulated illumination intensity with a simple mechanism ofmoving the plate in the direction of the arrangement of the mercurylamps. In addition, according to the present embodiment, irradiation ofthe radiation on the surface of the plate at the predeterminedaccumulated illumination intensity is ensured without measuring theillumination intensity (accumulated illumination intensity) on thesurface of the plate, since the relative relation among measurements isobtained by measuring the illumination intensity of the ultravioletlight at a plurality of points on the surface of the plate by theillumination intensity sensor 38 in advance, and then the accumulatedillumination intensity is monitored based on the illumination intensitymeasured with the illumination intensity sensor 38.

[0071] Second Embodiment

[0072] A wiring forming process, which is an example of a film patternforming process with respect to the surface treated plate according tothe present invention will be described as a second embodiment. Thewiring forming process according to the present embodiment includes theprocess of surface treatment, a discharging process, and a process ofheat treatment/optical treatment process. The respective processes willbe described below.

[0073] Process of Surface Treatment

[0074] A plate on which conductive film wiring is to be formed may be ofvarious types of material, such as Si wafer, quartz glass, glass,plastic film, or metal plate. Alternatively, the above-describedmaterials formed with a semiconductor film, metal film, dielectric film,or organic film on the surface thereof as a foundation layer may beemployed as the plate on which the conductive film wiring is to beformed.

[0075] The surface of the plate on which the conductive film wiring isto be formed is treated according to the process of the firstembodiment, so that a predetermined contact angle with respect to liquidcontaining conductive fine particles indicates the desirable value.

[0076] The desired contact angle is selected as needed according to thestep of discharging described later in detail. For example, the contactangle in the case where liquid drops are discharged over the liquiddrops previously discharged in sequence is preferably between 30 [deg.]and 60 [deg.] inclusive. In addition, in a discharging process in whicha plurality of liquid drops are discharged apart from each other so asnot to come into contact with each other in the first dischargingoperation, and then the remaining portion is filled in the second andsubsequent discharging operations, surface treatment with the contactangle of 60 [deg.] or larger, more preferably, between 90 [deg.] and 110[deg.] inclusive is preferable.

[0077] Discharging Process

[0078] Subsequently, using a liquid drop discharging process, a liquidmember containing conductive fine particles, which is material forforming conductive film wiring, is applied on the plate. As the liquidmember containing the conductive fine particles, a dispersion liquidobtained by dispersing conductive fine particles in a dispersion mediumis used.

[0079] For example, as conductive fine particles, oxide of the same,conductive polymer, and fine particles of superconductive polymer may beemployed in addition to metal fine particles containing any one of gold,silver, copper, palladium, and nickel.

[0080] These conductive fine particles may be used by being coated withorganic substance on the surface thereof in order to improve theirdispersion property.

[0081] The diameter of the conductive fine particle is preferablybetween 5 nm and 0.1 μm inclusive. When it is larger than 0.1 μm, thereis a risk that a nozzle of a liquid drop discharging head describedlater is clogged. In contrast, when it is smaller than 5 nm, the volumeratio of a coating agent with respect to the conductive fine particlesincreases, and hence the percentage of organic substance in the obtainedfilm will be excessive.

[0082] The dispersion medium is not specifically limited as long as itcan disperse the above-described conductive fine particles withoutgenerating cohesion. For example, in addition to water, alcohol such asmethanol, ethanol, propanol, and butanol, hydrocarbon chemical compoundssuch as n-heptane, n-octane, decane, dodecane, tetradecane, toluen,xylene, cymene, durene, indene, dipentene, tetrahydronaphthalene,decahydronaphthalene, and cyclohexylbenzene, ether contained chemicalcompounds such as Ethylene glycol dimethyl ether, Ethylene glycoldiethyl ether, Ethylene glycol methyl ethyl ether, Diethylene glycoldimethyl ether, Diethylene glycol diethyl ether, Diethylene glycolmethyl ethyl ether, 1,2-Dimethoxyethane, Bis(2-methoxyethyl) ether, andp-Dioxane, and polar chemical compounds such as Propylene carbonate,γ-Butyrolactone, N-Methyl-2-pyrrolidone, Dimethylformamide, Dimethylsulfoxide, and Cyclohexanone can be used. Among these media, water,alcohol group, hydrocarbon chemical compounds, ether containing chemicalcompound are preferable in terms of, dispersibility of fine particlesand stability of dispersion liquid ease of application to the liquiddrop discharging process (inkjet method), and more preferably, water andhydrocarbon chemical compounds are used as a dispersion medium.

[0083] The surface tension of dispersion liquid of conductive fineparticles is preferably in the range between 0.02 N/m and 0.07 N/minclusive. In the case where discharging liquid by the inkjet method, ifthe surface tension is below 0.02 N/m, wettability of the ink compoundwith respect to the nozzle surface increases, and hence deviation offlying direction is apt to occur. In contrast, if the surface tensionexceeds 0.07 N/m, the amount of discharge and timing are difficult tocontrol since the shape of meniscus at the extremity of the nozzle isnot stable. In order to adjust the surface tension, it is recommended toadd a slight amount of an agent such as fluorine contained-, siliconecontained-, or nonionic- surface tension control agent substance to thedispersion liquid to the extent in which the contact angle with theplate is not considerably lowered. Nonionic surface tension controlagent contributes to improve wettability of liquid with respect to theplate, improve a film leveling property, and prevent generation of fineroughness on the film. The above-described surface tension control agentmay include organic chemical compounds such as alcohol, ether, ester,ketone as needed.

[0084] The viscosity of the above-described dispersion liquid ispreferably between 1 Mpa.s and 50 Mpa.s inclusive. When dischargingliquid material as liquid drops using the inkjet method, when theviscosity is smaller than 1 Mpa.s, the portion around the nozzle is aptto be contaminated by ink flowing out therethrough, and when theviscosity is larger than 50 mPa.s, frequency of clogging of the nozzlehole increases, which hinders smooth discharge of liquid drops.

[0085] The discharging technology of the liquid drop discharging processincludes an electrostatic control system, a pressure and vibrationapplying system, an electric-mechanic conversion system, anelectric-thermal conversion system, and an electrostatic aspirationsystem. The electrostatic control system is a process of applyingelectric charge to the material via a charged electrode, and controllingthe flying direction of material by a polarized electrode to allow thematerial to be discharged from the nozzle. The pressure and vibrationapplying system is a process of applying a super-high pressure about 30kg/cm² to the material to allow the extremity of the nozzle to dischargethe material. In this system, when the control voltage is not applied,the material is injected from the nozzle in a straight manner, and whenthe control voltage is applied, electrostatic repulsion occurs in thematerial so that the material is dispersed and hence is not dischargedfrom the nozzle.

[0086] The electric-mechanic conversion system utilizes a property of apiezoelectric device deformed upon reception of a pulsated electricsignal, in which a pressure is applied to a space where the material isstored via a flexible substance by deformation of a piezoelectric deviceand hence the material is pushed out from the space and discharged fromthe nozzle. The electric-thermal conversion system is a process ofvaporizing the material rapidly by a heater provided in the space inwhich the material is stored to generate bubbles, and allows thematerial in the space to be discharged by the pressure of the bubbles.The electrostatic aspiration system is a process of applying a slightpressure in the space in which the material is stored to form a meniscusof material at the nozzle, and in this state, applying electrostaticattraction to draw out the material. There are also other applicabletechnologies such as a system of utilizing a variation of the viscosityof fluid due to the electric field, or a system of injecting by jumpspark.

[0087] The piezoelectric liquid drop discharging process performed inthe present embodiment has advantages in that waste of material is smalland a desired amount of material can be disposed at desired positionsaccurately. The amount of one drop of a liquid-state material (fluid) tobe discharged in the liquid drop discharging process is, for example, 1to 300 nanograms.

[0088]FIG. 3 is an explanatory drawing showing the principle ofdischarge of liquid material through a piezoelectric liquid dropdischarging head 10.

[0089] In FIG. 3, a piezoelectric device 22 is disposed adjacent to aliquid chamber 21 for storing the liquid material (ink for wiringpattern). The liquid chamber 21 receives a supply of liquid material viaa liquid material feed system 23 including a material tank for storingthe liquid material. The piezoelectric device 22 is connected to adriving circuit 24, and when a voltage is applied to the piezoelectricdevice 22 via the driving circuit 24, the piezoelectric device 22 isdeformed, and hence the liquid chamber 21 is deformed, whereby theliquid material is discharged from a nozzle 25. In this case, bychanging the value of applied voltage, the amount of deformation of thepiezoelectric device 22 is controlled. Also, by changing the frequencyof applied voltage, the speed of deformation of the piezoelectric device22 is controlled. Since liquid drop discharge according to thepiezoelectric system has an advantage in that constitution of thematerial is hardly affected because no heat is applied to the material.

[0090] In the present embodiment, liquid drops of the dispersion liquidare discharged from the liquid drop discharging head 10 and dropped onthe plate where the wiring is to be formed. At this time, it isnecessary to control the extent of overlapping of liquid dropsdischarged continuously so as not to generate a liquid pool (bulge). Itis also possible to employ such a discharging process in which aplurality of liquid drops are discharged apart from each other so as notto come into contact with each other in the first discharging operation,and the remaining portion is filled in the second and subsequentdischarging operations.

[0091] After the liquid drops have discharged, a drying process isperformed as needed in order to remove the dispersion medium. The dryingprocess can also be performed using, for example, a hot plate or anelectric furnace for heating a plate W as in the normal process, andalso by lamp annealing. Although the light source used for the lampannealing is not specifically limited, an infrared lamp, a xenon lamp, aYAG laser, an argon laser, a carbon dioxide laser, and an excimer lasersuch as XeF, XeCl, XeBr, KrF, KrCl, ArF, or ArCl may be used as a lightsource. Though the light source generally used here is one having anoutput between 10 W and 5000 W inclusive, the output between 100 W and1000 W is sufficient in the present embodiment.

[0092] Process of Heat Treatment/Optical Treatment

[0093] The dried film after the discharging process needs to be removedwith the dispersion medium completely in order to achieve good electriccontact between the fine particles. When the coating agent such asorganic substances is applied on the surface of conductive fineparticles for improving its dispersion property, this coating agent alsohas to be removed. Therefore, heat treatment and/or optical treatmentare performed on the plate after the discharging process.

[0094] Normally, the heat treatment and/or the optical treatment areperformed in ambient atmosphere. However, it can be performed in aninactive gas atmosphere, such as nitrogen, argon, and helium as needed.The treatment temperature for the heat treatment and/or the opticaltreatment is selected as needed considering the boiling point (steampressure) of the dispersion medium, the type or the pressure ofatmospheric gas, thermal behavior of the fine particles, such as thedispersion property or the oxidizing property, the presence or theamount of coating agent, or the heat-resistant temperature of the basematerial.

[0095] For example, in order to remove the coating agent formed of anorganic substance, it is necessary to bake at about 300° C. When a plateof plastic, for example, is used, it is preferable to perform at atemperature between the room temperature and 100° C. inclusive.

[0096] The heat treatment and/or the optical treatment can be performedby the hot plate or the electric furnace, which are normally used, andalso by lamp annealing. Although the light source used for lampannealing is not specifically limited, an infrared lamp, the xenon lamp,the YAG laser, the argon laser, the carbon dioxide laser, and theexcimer laser such as XeF, XeCl, XeBr, KrF, KrCl, ArF, or ArCl may beused as a light source. Though the light source generally used here isone having the output between 10 W and 5000 W inclusive, the outputbetween 100 W and 1000 W is sufficient in the present embodiment.

[0097] With the process described above, on the dried film after thedischarging process, electric contact between the fine particles isensured, and hence the film is converted into the conductive film.

[0098] Since the conductive film formed by the present embodiment isformed on the plate in which the hydrophilic property, that is, the dotdiameter and the contact angle are uniformly controlled, a thicker filmof thinner lines is achieved.

[0099] Therefore, according to the present embodiment, the filmthickness is large, which is advantageous for electric conduction, andhardly suffers from defects such as disconnection or short circuit. Inaddition, conductive film wiring which can be formed in minute detail isachieved.

[0100] As an example of a wiring pattern forming apparatus, a wiringforming device for embodying the above-described wiring pattern formingprocess will be described.

[0101]FIG. 4 is a general perspective view of the wiring forming deviceaccording to the present embodiment. As shown in FIG. 4, the wiringforming device 100 includes the liquid drop discharging head 10, anX-direction guiding shaft 2 for driving the liquid drop discharging head10 in the X-direction, an X-direction driving motor 3 for rotating theX-direction guiding shaft 2, a bed plate 4 for placing the plate 11, aY-direction guiding shaft 5 for driving the bed plate 4 in theY-direction, a Y-direction driving motor 6 for rotating the Y-directionguiding shaft 5, a cleaning mechanism section 14, a heater 15, and acontrol unit 8 for generally controlling these components. TheX-direction guiding shaft 2 and the Y-direction guiding shaft 5 arefixed on a base table 7, respectively. In FIG. 4, the liquid dropdischarging head 10 is disposed at a right angle with respect to thedirection of travel of the plate 11. However, the angle of the liquiddrop discharging head 10 can be adjusted so as to intersect with thedirection of travel of the plate 11. In this arrangement, the pitches ofthe nozzles can be adjusted by adjusting the angle of the liquid dropdischarging head 10. A configuration in which the distance between theplate 11 and the nozzle surface can be adjusted as desired is alsoapplicable.

[0102] The liquid drop discharging head 10 discharges liquid material ofa dispersion liquid containing conductive fine particles from the nozzle(discharge port), and is fixed to the X-direction guiding shaft 2. TheX-direction driving motor 3 is, for example, a stepping motor, androtates the X-direction guiding shaft 2 when a driving pulse signal ofthe X-axis direction is supplied from the control unit 8. When theX-direction guiding shaft 2 rotates, the liquid drop discharging head 10moves in the X-axis direction with respect to the base table 7.

[0103] As described above, the liquid drop discharging process may bevarious publicly known technologies such as a piezoelectric system, inwhich the piezoelectric device is used for allowing ink to bedischarged, or a bubble system in which the liquid material isdischarged by bubbles generated by heating the liquid material. Out ofthese two systems, the piezoelectric system does not apply heat to theliquid material, and hence it has an advantage in that constitution ofthe material is not affected.

[0104] The bed plate 4 is fixed to the Y-direction guiding shaft 5, andthe Y-direction driving motors 6, 16 are connected to the Y-directionguiding shaft 5. The Y-direction driving motors 6, 16 are steppingmotors and rotate the Y-direction guide shaft 5 when a driving pulsesignal in the Y-axis direction is supplied from the control unit 8. Thebed plate 4 moves in the Y-axis direction with respect to the base table7 by the rotation of the Y-direction guiding shaft 5.

[0105] The cleaning mechanism section 14 cleans the liquid dropdischarging head 10 and prevents the nozzle from clogging. The cleaningmechanism section 14 moves along the Y-direction guiding shaft 5 by theY-direction driving motor 16 during the above-described cleaningoperation.

[0106] The heater 15 provides heat treatment on the plate 11 using theheating means, such as lamp annealing or the like, promotes vaporizationand drying of liquid discharged on the plate 11, and performs heattreatment for converting it into the conductive film.

[0107] In the wiring forming device 100 of the present embodiment, theliquid material is disposed on the plate 11 by moving the plate 11 andthe liquid drop discharging head 10 with respect to each other via theX-direction driving motor 3 and/or the Y-direction driving motor 6 whiledischarging the liquid material from the liquid drop discharging head10.

[0108] The amount of liquid drops discharged from each nozzle of theliquid drop discharging head 10 is controlled by a voltage supplied fromthe control unit 8 to the piezoelectric device.

[0109] The pitches of the liquid drops disposed on the plate 11 arecontrolled by the speed of the above-described relative movement and thedischarging frequency from the liquid drop discharging head 10(frequency of the driving voltage to the piezoelectric device).

[0110] The position to initiate dropping of liquid drops on the plate 11is controlled by controlling the direction of the above-describedrelative movement and the timing of initiation of discharge of theliquid drops from the liquid drop discharging head 10 during theabove-described relative movement.

[0111] Accordingly, the conductive film pattern for wiring describedabove is formed on the plate 11.

[0112] Third Embodiment

[0113] As a third embodiment, a liquid crystal display device, which isan example of an electro-optic device of the present invention will bedescribed. FIG. 5 shows a plan layout of a signal electrode on a firstplate of the liquid crystal display device according to the presentembodiment. The liquid crystal display device according to the presentembodiment generally includes the first plate, a second plate (notshown) provided with a scanning electrode and so on, and liquid crystal(not shown) encapsulated between the first plate and the second plate.

[0114] As shown in FIG. 5, a plurality of signal electrodes 310 . . .are provided in a multiple matrix manner on a pixel area 303 on thefirst plate 300. In particular, each signal electrode 310 . . . includesa plurality of pixel electrode portions 310 a . . . providedcorresponding to each pixel, and signal wiring portions 310 b . . . forconnecting the pixel electrode portions 310 a . . . in a multiple matrixmanner, and extends in the Y-direction.

[0115] Reference numeral 350 designates a liquid crystal driving circuitincluding a single chip, and the liquid crystal driving circuit 350 andeach signal wiring portion 310 b are connected via first leader wirings331 . . . at one end (lower end in the drawing).

[0116] Reference numerals 340 . . . designate vertical conductingterminals, and the vertical conducting terminals 340 . . . and theterminal provided on the second plate, not shown, are connected by thevertical conducting materials 341 . . . . The vertical conductingterminals 340 . . . and the liquid crystal driving circuit 350 areconnected by the second leader wirings 332 . . . .

[0117] According to the present embodiment, the signal wiring portions310 b . . . provided on the first plate 300, the first leader wirings331 . . . , the second leader wirings 332 . . . are formed by the wiringforming process according to the second embodiment respectively.

[0118] According to the liquid crystal display device of the presentembodiment, the liquid crystal display device in which defects such asdisconnection or short circuit of the respective wirings hardly occur,and downsizing and reduction of thickness are achieved.

[0119] Subsequently, another embodiment of the liquid crystal displaydevice, which is the electro-optic device of the present invention, willbe described.

[0120] A liquid crystal display device (electro-optic device) 901 shownin FIG. 6 roughly includes a colored liquid crystal panel(electro-optical panel) 902, and a circuit plate 903 to be connected tothe liquid crystal panel 902. When needed, an illumination device suchas a back light or the like, or other accessories are provided on theliquid crystal panel 902.

[0121] The liquid crystal panel 902 includes a pair of plates 905 a and905 b adhered by a sealing material 904, and liquid crystal isencapsulated in a gap defined between the plate 905 b and the plate 905b, that is, in a cell gap. The plate 905 a and the plate 905 b aregenerally formed of translucent material, such as glass or syntheticresin. A deflecting plate 906 a and a deflecting plate 906 b are adheredon the outer surfaces of the plate 905 a and the plate 905 b. In FIG. 9,the deflecting plate 906 b is not shown.

[0122] An electrode 907 a is formed on the inner surface of the plate905 a, and an electrode 907 b is formed on the inner surface of theplate 905 b. These electrodes 907 a, 907 b are formed in stripes,characters, numbers or other appropriate patterns. The electrodes 907 a,907 b are formed of translucent material, for example, ITO (Indium TinOxide). The plate 905 a includes an overhanging portion overhangingtoward the plate 905 b, and a plurality of terminals 908 are formed onthe overhanging portion. These terminals 908 are formed simultaneouslywith the electrode 907 a when forming the electrode 907 a on the plate905 a. Therefore, these terminals 908 are formed, for example, of ITO.These terminals 908 include the one extending from the electrode 907 a,and the one connected to the electrode 907 b via the conductive material(not shown).

[0123] A semiconductor device 900 as a liquid crystal driving IC ismounted at a predetermined position on a wiring plate 909 of the circuitplate 903. Though it is not shown in the drawing, a resistor, acondenser, or other chip components may be mounted at predeterminedpositions other than the portion to which the semiconductor device 900is mounted. The wiring plate 909 is fabricated by patterning a metalfilm such as Cu formed on a base plate 911 having flexibility, such aspolyimide, and forming a wiring pattern 912.

[0124] According to the present embodiment, the electrodes 907 a, 907 bof the liquid crystal panel 902 and the wiring pattern 912 in thecircuit plate 903 are formed by the wiring forming process according tothe second embodiment.

[0125] According to the liquid crystal display device of the presentembodiment, a liquid crystal display device, in which defects such asdisconnection or short circuit of the above-described respective wiringhardly occur, and downsizing and reduction in thickness are possible, isobtained.

[0126] While the example shown above is a passive-type liquid crystalpanel, an active matrix type liquid crystal panel is also applicable. Inother words, a thin film transistor (TFT) is formed on one of theplates, and a pixel electrode is formed for each TFT. Wirings forelectrically connecting to the respective TFT (gate wiring, sourcewiring) can be formed by the inkjet technology as described above.

[0127] On the other hand, opposing electrodes and the like are formed onthe opposed plate. The present invention can be applied also to theactive matrix liquid crystal panel as described above.

[0128] Fourth Embodiment

[0129] As a fourth embodiment, a plasma-type display device, which is anexample of the electro-optic device of the present invention will bedescribed. FIG. 7 shows an exploded perspective view of a plasma-typedisplay device 500 of the present embodiment.

[0130] The plasma-type display device 500 of the present embodimentgenerally includes a glass plate 501 and a glass plate 502 opposed toeach other, and a discharge display unit 510 formed between these glassplates. The discharge display unit 510 includes a plurality ofaggregated discharge chambers 516, and out of the plurality of dischargechambers 516, three discharge chambers 516; a red discharge chamber 516(R), a green discharge chamber 516 (G), and a blue discharge chamber 516(B); form a group and constitute one pixel.

[0131] Address electrodes 511 are formed into stripes at predeterminedintervals on the upper surface of the (glass) plate 501, and adielectric layer 519 is formed so as to cover the address electrodes 511and the upper surface of the plate 501, and further, partition walls 515are formed on the dielectric layer 519 between the address electrodes511, 511 so as to extend along the respective address electrodes 511.The partition walls 515 are partitioned at predetermined intervals inthe direction orthogonal to the address electrodes 511 at predeterminedpositions along the length thereof (not shown), and basically,rectangular areas partitioned by partition walls adjacent to the addresselectrodes 511 on the left and right sides thereof in the widthwisedirection and the partition walls extending in the direction orthogonalto the address electrodes 511 are defined, and the discharge chambers516 are formed so as to correspond to these rectangular areas. Three ofthese rectangular areas form a group, and constitute one pixel. Disposedwithin the rectangular areas partitioned by the partition walls 515 arefluorescent members 517. The fluorescent members 517 emit fluorescentlight of any one of red, green, or blue. A red fluorescent member 517(R)is disposed on the bottom of the red discharge chamber 516(R), a greenfluorescent member 517(G) is disposed on the bottom of the greendischarge chamber 516(G), and a blue fluorescent member 517 (B) isdisposed on the bottom of the blue discharge chamber 516(B),respectively.

[0132] Subsequently, on the side of the glass plate 502, there areprovided a plurality of display electrodes 512 in the directionorthogonal to the aforementioned address electrodes 511 in stripes ofpredetermined intervals, a dielectric layer 513 is formed so as to coverthe display electrodes 512, and a protective film 514, for example, ofMgO is formed thereon.

[0133] The plate 501 and the glass plate 502 are bonded with each otherwith the address electrodes 511 . . . and the display electrodes 512 . .. orthogonally opposed, and the discharge chambers 516 are defined bydischarging air from a space surrounded by the plate 501, the partitionwalls 515, and the protective film 514 formed on the side of the glassplate 502 and charging rare gas. The display electrode 512 on the glassplate 502 is formed two each for each discharge chamber 516.

[0134] The address electrodes 511 and the display electrodes 512 areconnected to an AC power source, not shown, and electricity is suppliedto each electrode, whereby the fluorescent members 517 in the dischargedisplay unit 510 at required positions are excited, and thus emit lightto achieve a color display.

[0135] According to the present embodiment, the address electrodes 511,and the display electrodes 512 are formed by the wiring forming processof the second embodiment.

[0136] According to the plasma-type display device of the presentembodiment, a plasma-type display device, in which defects such asdisconnection or short circuit of each electrode hardly occur, anddownsizing and reduction in thickness are possible, is obtained.

[0137] Fifth Embodiment

[0138] As a fifth embodiment, an embodiment of a non-contact card mediumof the present invention will be described. As shown in FIG. 8, thenon-contact card medium (electronic equipment) 400 of the presentembodiment is configure in such a manner that a semiconductor integratedcircuit chip 408 and an antenna circuit 412 are integrated in anenclosure including a card body 402 and a card cover 418, and at leastone of electric supply and data transfer is performed by at least one ofan outside transmitter, not shown, and electromagnetic wave or byelectrostatic capacity bonding.

[0139] In the present embodiment, the antenna circuit 412 is formed bythe wiring forming process according to the second embodiment.

[0140] According to the non-contact card medium of the presentembodiment, a non-contact card medium in which defects such asdisconnection or short circuit of the antenna circuit 412 hardly occur,and downsizing and reduction in thickness are possible, is obtained.

[0141] Sixth Embodiment

[0142] As a sixth embodiment, a field emission display (hereinafter,referred to as “FED”, which is an electro-optic device provided with afield emission element (electricity emission element) will be described.

[0143] FIGS. 9A-C are explanatory drawings showing the FED. Fig. 9(a) isa general block diagram showing the layout of a cathode plate and ananode plate, which constitute the FED. FIG. 9(b) is a schematic blockdiagram of the driving circuit provided on the cathode plate of the FED.FIG. 9(c) is a perspective view showing a principal portion of thecathode plate.

[0144] As shown in FIG. 9(a), the FED (electro-optic device) 200includes the cathode plate 200 a and the anode plate 200 b disposed soas to oppose to each other. The cathode plate 200 a includes, as shownin FIG. 9(b), gate lines 201, emitter lines 202, and field emissionelement 203 connected to the gate liens 201 and the emitter lines 202.That is, so called simple matrix driving circuit is formed. The gatelines 201 are configured to receive gate signals V1, V2, . . . , Vm, andthe emitter lines 202 are configured to receive emitter signals W1, W2,. . . , Wn. The anode plate 200 b is provided with fluorescent memberscomposed of RGB, and the fluorescent members have a property to emitlight when subjected to electron.

[0145] As shown in FIG. 9(c), the field emission element 203 includesemitter electrodes 203 a connected to the emitter lines 202, and gateelectrodes 203 b connected to the gate lines 201. Furthermore, theemitter electrode 203 a is provided with projections called emitter tips205 tapered from the emitter electrode 203 a toward the gate electrode203 b. The gate electrode 203 b is formed with holes 204 at thepositions corresponding to the emitter tips 205, so that the extremitiesof the emitter tips 205 are placed in the holes 204.

[0146] In the FED 200 constituted as described above, a voltage issupplied between the emitter electrodes 203 a and the gate electrodes203 b by controlling the gate signals V1, V2, . . . , Vm of the gateliens 201, and the emitter signals W1, W2, . . . , Wn of the emitterlines 202, then electrons 210 move from the emitter tips 205 into theholes 204 by the action of electrolyzation, and the electrons 210 isemitted from the extremities of the emitter tips 205. At this time,light is emitted when the electrons 210 and the fluorescent member ofthe anode plate 200 b come into contact. Thus, desired driving of theFED 200 is achieved.

[0147] In the FED thus configured, for example, the emitter electrodes203 a, the emitter lines 202, and in addition, the gate electrodes 203 bor the gate lines 201 are formed by the wiring forming process accordingto the second embodiment.

[0148] According to the FED of the present embodiment, an FED, in whichdefects such as disconnection or short circuit of the wirings hardlyoccur, and downsizing and reduction in thickness is possible, isobtained.

[0149] Seventh Embodiment

[0150] As a seventh embodiment, detailed examples of electronicequipment of the present invention will be described.

[0151]FIG. 10(a) is a perspective view showing an example of a mobiletelephone. In FIG. 10(a), reference numeral 600 designates a mobiletelephone body, and reference numeral 601 designates a liquid crystaldisplay unit provided with the liquid crystal display device accordingto the third embodiment.

[0152]FIG. 10(b) is a perspective view showing an example of a portableinformation processing device, such as a word processor, or a personalcomputer. In FIG. 10(b), reference numeral 700 designates an informationprocessing device, reference numeral 701 designates an input device suchas a keyboard, reference numeral 703 designates an informationprocessing body, and reference numeral 702 designates a liquid crystaldisplay unit provided with the liquid crystal display device accordingto the third embodiment.

[0153]FIG. 10(c) is a perspective view showing an example of watch typeelectronic equipment. In FIG. 10(c), reference numeral 800 designates awatch body, and reference numeral 801 designates a liquid crystaldisplay unit provided with the liquid crystal display device of thethird embodiment.

[0154] The electronic equipment shown in FIGS. 10(a)-(c) are providedwith the liquid crystal display device of the embodiments describedabove, defects such as disconnection or short circuit of the wiringshardly occur, and downsizing and reduction in thickness is possible.

[0155] While electronic equipment of the present embodiment is providedwith the liquid crystal display device, electronic equipment providedwith other electro-optic devices such as an organic electroluminescencedisplay device, a plasma-type display device, and an FED is alsoapplicable.

[0156] While the preferred embodiments of the present invention havebeen described thus far referring to the attached drawings, it is to beunderstood that the present invention is not limited to thoseembodiments. The shape or combination of the respective components shownin the embodiments described above are simply shown as an example, andvarious modifications may be made based on deign requirements withoutdeparting the scope of the invention.

[0157] For example, the embodiments employ the configuration in whichthe plate is moved with respect to the mercury lamps, which are thesources of radiation (energy light). However, the invention is notlimited thereto, and a configuration in which the mercury lamps aremoved with respect to the plate may be employed. The process of relativemovement between the radiation source and the plate is not limited tothe swinging or reciprocating motion, a relative movement in onedirection, or a relative rotation may be employed. In addition, aprocedure in which the relative movement between the radiation sourcesand the plate is repeated while varying the speed of the relativemovement between the plate and the radiation source by each movement orchanging the levels of the plate and the radiation sources may also beapplicable. The radiation source is not limited to the mercury lamp, andother radiation sources can be employed as long as radiation forproviding the hydrophilic property to the surface of the plate can beirradiated.

What is claimed is:
 1. A process of surface treatment comprising: a stepof providing a hydrophobic property to a surface of a plate; and a stepof providing a hydrophilic property to the surface of the plate providedwith the hydrophobic property by irradiating radiation thereon; whereinvariations in accumulated illumination intensity of the radiation on thesurface of the plate are controlled to 20% or less.
 2. A process ofsurface treatment according to claim 1, wherein variations inaccumulated illumination intensity of the radiation on the surface ofthe plate are controlled to 15% or less.
 3. A process of surfacetreatment according to claim 1, further comprising irradiating theradiation while relatively moving the plate with respect to a source ofthe radiation.
 4. A process of surface treatment according to claim 3,further comprising moving the plate with respect to a plurality ofarranged radiation sources in a direction of arrangement of theplurality of radiation sources.
 5. A process of surface treatmentaccording to claim 1, further comprising: a step of measuringillumination intensity of the radiation at a plurality of points on thesurface of the plate and in a vicinity of the plate before providing thehydrophilic property; and a step of controlling irradiation of theradiation based on the accumulated illumination intensity of theradiation in the vicinity of the plate measured during the process ofproviding the hydrophilic property.
 6. A surface treated platecomprising a plate having the surface treatment applied by the processof surface treatment according to claim
 1. 7. An electro-optic devicecomprising a conductive film wiring formed on the surface treated plateaccording to claim
 6. 8. Electronic equipment comprising theelectro-optic device according to claim
 7. 9. A surface treating devicefor irradiating radiation on the surface of a plate and providing ahydrophilic property to the surface, wherein a reciprocating device forrelatively moving the source of the radiation and the plate.
 10. Asurface treating device according to claim 9, wherein the plate isrelatively moved along a direction of arrangement of a plurality of rowsof radiation sources.